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1

Comparison of insulin hypoglycemia and short metyrapone tests in patients with pituitary disease

K. Achenbach, W. Oelkers, M. Mahlcke, H. Harendt

Journal:

Journal of Molecular Medicine

Year:

1985

Language:

english

File:

PDF, 631 KB

english, 1985

2

Silicon direct bonding for sensor applications: Characterization of the bond quality

Christine Harendt, Bernd Hofflinger, Heinz-Gerd Graf, Elisabeth Penteker

Journal:

Sensors and Actuators A: Physical

Year:

1990

Language:

english

File:

PDF, 1.29 MB

english, 1990

3

Wafer bonding: Investigation and in situ observation of the bond process

Christine Harendt, Heinz-Gerd Graf, Elisabeth Penteker, Bernd Höfflinger

Journal:

Sensors and Actuators A: Physical

Year:

1990

Language:

english

File:

PDF, 966 KB

english, 1990

4

Silicon on insulator material by Wafer Bonding

Christine Harendt, Charles E. Hunt, Wolfgang Appel, Heinz-Gerd Graf, Bernd Höfflinger, Elisabeth Penteker

Journal:

Journal of Electronic Materials

Year:

1991

Language:

english

File:

PDF, 3.81 MB

english, 1991

5

Statistical patterns: an approach for high-speed and high-accuracy shape measurements

Schaffer, Martin, Große, Marcus, Harendt, Bastian, Kowarschik, Richard

Journal:

Optical Engineering

Year:

2014

Language:

english

File:

PDF, 2.72 MB

english, 2014

6

Outdoor three-dimensional shape measurements using laser-based structured illumination

Schaffer, Martin, Große, Marcus, Harendt, Bastian, Kowarschik, Richard

Journal:

Optical Engineering

Year:

2012

Language:

english

File:

PDF, 784 KB

english, 2012

7

Ökonomische Resilienz — Schlüsselbegriff für ein neues wirtschaftspolitisches Leitbild?; Economic Resilience — A New Concept for Policy-Making?;

Brinkmann, Henrik, Harendt, Christoph, Heinemann, Friedrich, Nover, Justus

Journal:

Wirtschaftsdienst

Year:

2017

Language:

german

File:

PDF, 186 KB

german, 2017

8

Adaptive Layout Technique for Microhybrid Integration of Chip-Film Patch

Alavi, Golzar, Sailer, Holger, Albrecht, Bjoern, Harendt, Christine, Burghartz, Joachim N.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 3.71 MB

english, 2018

9

Entwicklung leistungsfähiger Stickstofflaser mit abgeschmolzenem Laserrohr

H. Gündel, W. Ross, K. Seliger, H. Volkmann, H. Erbs, A. Harendt, J. Irmer, H. Schöpp

Journal:

Contributions to Plasma Physics

Year:

1985

File:

PDF, 805 KB

1985

10

The interaction of CO with copper (110) studied by TDS and LEED

C. Harendt, J. Goschnick, W. Hirschwald

Journal:

Surface Science Letters

Year:

1985

Language:

english

File:

PDF, 55 KB

english, 1985

11

Model bimetallic catalysts: The preparation and characterisation of Au/Ru(0001) surfaces and the adsorption of carbon monoxide

C. Harendt, K. Christmann, W. Hirschwald, J.C. Vickerman

Journal:

Surface Science Letters

Year:

1986

Language:

english

File:

PDF, 55 KB

english, 1986

12

A study of the adsorption and decomposition of d4-ethene on model bimetallic Au/Ru(0001) surfaces using SSIMS and EELS

B. Sakakini, N. Dunhill, C. Harendt, B. Steeples, J.C. Vickerman

Journal:

Surface Science Letters

Year:

1987

Language:

english

File:

PDF, 51 KB

english, 1987

13

A smart power process in “direct-bonded” silicon on insulator with 150 V VDMOS, CMOS and bipolar transistors

T. Ifström, U. Apel, H.-G. Graf, C. Harendt, B. Höfflinger

Journal:

Microelectronic Engineering

Year:

1992

Language:

english

File:

PDF, 401 KB

english, 1992

14

A combined HREELS and SSIMS study of the adsorption of co on Ru/Cu and Ru/Au bimetallic surfaces

C. Harendt, B. Sakakini, J.A van den Berg, J.C. Vickerman

Journal:

Journal of Electron Spectroscopy and Related Phenomena

Year:

1986

Language:

english

File:

PDF, 544 KB

english, 1986

15

Static and dynamic behaviour of power devices in silicon-direct-bonded substrates

U. Apel, H.-G. Graf, C. Harendt, B. Höfflinger

Journal:

Materials Science and Engineering: B

Year:

1995

Language:

english

File:

PDF, 428 KB

english, 1995

16

Ultra-thin chip technology and applications, a new paradigm in silicon technology

Joachim N. Burghartz, Wolfgang Appel, Christine Harendt, Horst Rempp, Harald Richter, Martin Zimmermann

Journal:

Solid-State Electronics

Year:

2010

Language:

english

File:

PDF, 2.31 MB

english, 2010

17

An EELS study of the adsorption and decomposition of deuterated ethene on Cu/Ru(0001)

B. Sakakini, C. Harendt, J.C. Vickerman

Journal:

Spectrochimica Acta Part A: Molecular Spectroscopy

Year:

1987

Language:

english

File:

PDF, 368 KB

english, 1987

18

Transverse Spatial Resolution of Thermo–Optical Hysteresis in CdS

H. X. Nguyen, V. D. Egorov, A. Harendt, E. V. Nazvanova

Journal:

physica status solidi (b)

Year:

1988

Language:

english

File:

PDF, 356 KB

english, 1988

19

Amorphous silicon based p-i-i-n photodetectors for point-of-care testing

Marc Sämann, Dominik Furin, Johannes Thielmann, Albrecht Pfäfflin, Günther Proll, Christine Harendt, Günther Gauglitz, Erwin Schleicher, Markus B. Schubert

Journal:

physica status solidi (c)

Year:

2010

Language:

english

File:

PDF, 255 KB

english, 2010

20

A 100-V lateral DMOS transistor with a 0.3-micrometer channel in a 1-micrometer silicon-film-on-insulator-on-silicon

Apel, U., Graf, H.G., Harendt, C., Hofflinger, B., Ifstrom, T.

Journal:

IEEE Transactions on Electron Devices

Year:

1991

Language:

english

File:

PDF, 480 KB

english, 1991

21

High-speed three-dimensional shape measurements of objects with laser speckles and acousto-optical deflection

Schaffer, Martin, Grosse, Marcus, Harendt, Bastian, Kowarschik, Richard

Journal:

Year:

2011

Language:

english

File:

PDF, 274 KB

english, 2011

22

High-Speed Optical 3-D Measurements for Shape Representation

Schaffer, M., Große, M., Harendt, B., Kowarschik, R.

Journal:

Optics and Photonics News

Year:

2011

Language:

english

File:

PDF, 211 KB

english, 2011

23

Compensation of externally applied mechanical stress by stacking of ultrathin chips

Stefan Endler, Horst Rempp, Christine Harendt, Joachim N. Burghartz

Journal:

Solid-State Electronics

Year:

2012

Language:

english

File:

PDF, 1.10 MB

english, 2012

24

High Dynamic Range CMOS Imager Technologies for Biomedical Applications

Graf, H.-G., Harendt, C., Engelhardt, T., Scherjon, C., Warkentin, K., Richter, H., Burghartz, J.N.

Journal:

IEEE Journal of Solid-State Circuits

Year:

2009

Language:

english

File:

PDF, 2.60 MB

english, 2009

25

Model bimetallic catalysts: The preparation and characterisation of Au/Ru(0001) surfaces and the adsorption of carbon monoxide

C. Harendt, K. Christmann, W. Hirschwald, J.C. Vickerman

Journal:

Surface Science

Year:

1986

Language:

english

File:

PDF, 973 KB

english, 1986

26

The interaction of Co with copper (110) studied by TDS and LEED

C. Harendt, J. Goschnick, W. Hirschwald

Journal:

Surface Science

Year:

1985

Language:

english

File:

PDF, 649 KB

english, 1985

27

A study of the adsorption and decomposition of d4-ethene on model bimetallic Au/Ru(0001) surfaces using SSIMS and EELS

B. Sakakini, N. Dunhill, C. Harendt, B. Steeples, J.C. Vickerman

Journal:

Surface Science

Year:

1987

Language:

english

File:

PDF, 374 KB

english, 1987

28

Two-Dimensional Flex Sensor Exploiting Stacked Ultrathin Chips

Endler, S., Ferwana, S., Rempp, H., Harendt, C., Burghartz, J.N.

Journal:

IEEE Electron Device Letters

Year:

2012

Language:

english

File:

PDF, 602 KB

english, 2012

29

Numerical modelling of fast-flow CO 2 lasers. I. The model

Rudolph, R, Harendt, A, Bisin, P, Gundel, H

Journal:

Journal of Physics D Applied Physics

Year:

1993

Language:

english

File:

PDF, 406 KB

english, 1993

30

Silicon fusion bonding and its characterization

Harendt, C, Graf, H G, Hofflinger, B, Penteker, E

Journal:

Journal of Micromechanics and Microengineering

Year:

1992

Language:

english

File:

PDF, 294 KB

english, 1992

31

[IEEE 2010 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2010.12.6-2010.12.8)] 2010 International Electron Devices Meeting - Ultra-thin chip technology for system-in-foil applications

Angelopoulos, Evangelos A., Zimmermann, Martin, Appel, Wolfgang, Endler, Stefan, Ferwana, Saleh, Harendt, Christine, Tu Hoang,, Pruemm, Andreas, Burghartz, Joachim N.

Year:

2010

Language:

english

File:

PDF, 1.03 MB

english, 2010

32

[IEEE 2009 IEEE Bipolar/BiCMOS Circuits and Technology Meeting - BCTM - Capri, Italy (2009.10.12-2009.10.14)] 2009 IEEE Bipolar/BiCMOS Circuits and Technology Meeting - Ultra-thin chip fabrication for next-generation silicon processes

Burghartz, Joachim N., Harendt, Christine, Hoang, Tu, Kiss, Astrid, Zimmermann, Martin

Year:

2009

Language:

english

File:

PDF, 1.65 MB

english, 2009

33

A comparison of the effects of Cu and Au on the surface reactivity of Ru(0001)

Sakakini, Bahij, Swift, Andrew J., Vickerman, John C., Harendt, Christine, Christmann, Klaus

Journal:

Journal of the Chemical Society Faraday Transactions 1

Year:

1987

Language:

english

File:

PDF, 1.67 MB

english, 1987

34

[IEEE 2009 Proceedings of ESSCIRC (ESSCIRC) - Athens, Greece (2009.09.14-2009.09.18)] 2009 Proceedings of ESSCIRC - Ultra-thin chips and related applications, a new paradigm in silicon technology

Burghartz, Joachim N., Appel, Wolfgang, Harendt, Christine, Rempp, Horst, Richter, Harald, Zimmermann, Martin

Year:

2009

Language:

english

File:

PDF, 2.33 MB

english, 2009

35

[IEEE 2013 Symposium on Microelectronics Technology and Devices (SBMicro) - Curitiba, Brazil (2013.09.2-2013.09.6)] 28th Symposium on Microelectronics Technology and Devices (SBMicro 2013) - Ultra-thin Si chips for flexible electronics Process technology, characterization, assembly and applications

Burghartz, J. N., Angelopoulos, E., Appel, W., Endler, S., Ferwana, S., Harendt, C., Hassan, M.-U., Rempp, H., Richter, H., Zimmermann, M.

Year:

2013

Language:

english

File:

PDF, 893 KB

english, 2013

36

[IEEE 1990 IEEE SOS/SOI Technology Conference. - Key West, FL, USA (2-4 Oct. 1990)] 1990 IEEE SOS/SOI Technology Conference. Proceedings - Highly selective etch stop by stress compensation for thin-film BESOI

Hunt, C.E., Rouse, G.V., Harendt, C., Green, M.L.

Year:

1990

Language:

english

File:

PDF, 159 KB

english, 1990

37

[IEEE 2009 Proceedings of the European Solid State Device Research Conference (ESSDERC) - Athens, Greece (2009.09.14-2009.09.18)] 2009 Proceedings of the European Solid State Device Research Conference - Ultra-thin chips and related applications, a new paradigm in silicon technology

Burghartz, Joachim N., Appel, Wolfgang, Harendt, Christine, Rempp, Horst, Richter, Harald, Zimmermann, Martin

Year:

2009

Language:

english

File:

PDF, 2.41 MB

english, 2009

38

[IEEE ESSDERC 2011 - 41st European Solid State Device Research Conference - Helsinki, Finland (2011.09.12-2011.09.16)] 2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC) - Compensation of externally applied mechanical stress by stacking of ultra-thin chips

Endler, Stefan, Rempp, Horst, Harendt, Christine, Burghartz, Joachim N.

Year:

2011

Language:

english

File:

PDF, 1.47 MB

english, 2011

39

[IEEE ESSDERC 2012 - 42nd European Solid State Device Research Conference - Bordeaux, France (2012.09.17-2012.09.21)] 2012 Proceedings of the European Solid-State Device Research Conference (ESSDERC) - Manufacturing aspects of an ultra-thin chip technology

Angelopoulos, Evangelos A., Al-Shahed, Muhammad S., Appel, Wolfgang, Endler, Stefan, Ferwana, Saleh, Harendt, Christine, Hassan, Mahadi-Ul, Rempp, Horst, Zimmermann, Martin, Burghartz, Joachim N.

Year:

2012

Language:

english

File:

PDF, 1.20 MB

english, 2012

40

[IEEE 2011 Semiconductor Conference Dresden (SCD) - Dresden, Germany (2011.09.27-2011.09.28)] 2011 Semiconductor Conference Dresden - Mechanical characterisation of ultra-thin chips

Endler, S., Hoang, T., Angelopoulos, E. A., Rempp, H., Harendt, C., Burghart, J. N.

Year:

2011

Language:

english

File:

PDF, 1.57 MB

english, 2011

41

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Self-aligned through silicon vias in ultra-thin chips for 3D-integration

Ferwana, Saleh, Harendt, Christine, Letzkus, Florian, Burghartz, Joachim N.

Year:

2012

Language:

english

File:

PDF, 9.44 MB

english, 2012

42

[IEEE 2009 IEEE International Conference on IC Design and Technology (ICICDT) - Austin, TX, USA (2009.05.18-2009.05.20)] 2009 IEEE International Conference on IC Design and Technology - Technology and design aspects of ultra-thin silicon chips for bendable electronics

Richter, Harald, Rempp, Horst D., Hassan, Mahadi-Ul, Harendt, Christine, Wacker, Nicoleta, Zimmermann, Martin, Burghartz, Joachim N.

Year:

2009

Language:

english

File:

PDF, 646 KB

english, 2009

43

[IEEE 2013 IEEE International Conference of Electron Devices and Solid-State Circuits (EDSSC) - Hong Kong, Hong Kong (2013.06.3-2013.06.5)] 2013 IEEE International Conference of Electron Devices and Solid-state Circuits - Ultra-thin chips for flexible electronics

Burghartz, J. N., Angelopoulos, E., Appel, W., Endler, S., Ferwana, S., Harendt, C., Hassan, M.-U., Rempp, H., Richter, H., Zimmermann, M.

Year:

2013

Language:

english

File:

PDF, 321 KB

english, 2013

44

A 150-V multiple up-drain VDMOS, CMOS, and bipolar process in 'direct-bonded' silicon on insulator on silicon

Ifstrom, T., Apel, U., Graf, H.-G., Harendt, C., Hofflinger, B.

Journal:

IEEE Electron Device Letters

Year:

1992

Language:

english

File:

PDF, 185 KB

english, 1992

45

[IEEE 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings - Shanghai, China (2006.10.23-2006.10.26)] 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings - HDR CMOS imagers and their applications

Burghartz, Joachim, Graf, H.-g., Harendt, C., Klingler, W., Richter, H., Strobel, M.

Year:

2006

Language:

english

File:

PDF, 550 KB

english, 2006

46

[IEEE 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII) - Barcelona, Spain (2013.06.16-2013.06.20)] 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII) - A flexible stress sensor using a sub-10μm silicon chip technology

Ferwana, S., Angelopoulos, E. A., Endler, S., Harendt, C., Burghartz, J. N.

Year:

2013

Language:

english

File:

PDF, 5.78 MB

english, 2013

47

[IEEE 1995 IEEE International SOI Conference - Tucson, AZ, USA (3-5 Oct. 1995)] 1995 IEEE International SOI Conference Proceedings - Wafer bonding for intelligent power ICs: integration of vertical structures

Harendt, C., Wondrak, W., Apel, U., Graf, H.-G., Hofflinger, B., Korec, J., Penteker, E.

Year:

1995

Language:

english

File:

PDF, 266 KB

english, 1995

48

[IEEE 12th European Quantum Electronics Conference CLEO EUROPE/EQEC - Munich, Germany (2011.05.22-2011.05.26)] 2011 Conference on Lasers and Electro-Optics Europe and 12th European Quantum Electronics Conference (CLEO EUROPE/EQEC) - Amorphous silicon based photodetectors for biosensing

Schubert, M. B., Samann, M., Furin, D., Thielmann, J., Harendt, C., Gauglitz, G.

Year:

2011

Language:

english

File:

PDF, 96 KB

english, 2011

49

[IEEE 2008 International Solid-State Circuits Conference - (ISSCC) - San Francisco, CA, USA (2008.02.3-2008.02.7)] 2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers - Ultra-Thin Chips on Foil for Flexible Electronics

Rempp, Horst, Burghartz, Joachim, Harendt, Christine, Pricopi, Nicoleta, Pritschow, Marcus, Reuter, Christian, Richter, Harald, Schindler, Inge, Zimmermann, Martin

Year:

2008

Language:

english

File:

PDF, 497 KB

english, 2008

50

Application of Histogram and Template Matching Methods for Radiographic Image Comparison

Döler, W., Harendt, N., Jäger, A., Steinhöfel, N.

Journal:

Zeitschrift für Medizinische Physik

Year:

1991

Language:

english

File:

PDF, 4.63 MB

english, 1991

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